TG-30 Premium CPU/GPU Heatsink Thermal Compound

$15,45

Designed to lower CPU temperatures effectively, TG-30 is a premium thermal compound which contains diamond powder to improve thermal conductivity to maximize heat transfer, providing a longer lifespan eliminating dry-out or cracking while in use. This thermal compound application kit includes a set of easily-applied tools for immediate use. On top of that, the TG-30 s honeycomb stencil can help users to apply thermal compound for a neat and well-covered surface which fits all CPUs

Out of stock

SKU: GRG510191639 Category:

Description

[{“name”:”Dispenser Type”,”normalizedValue”:”Syringe”,”value”:”Syringe”},{“name”:”Thermal Conductivity”,”normalizedValue”:”4.5W/m-K”,”value”:”4.5W/m-K”},{“name”:”Item”,”normalizedValue”:”Thermal Grease”,”value”:”Thermal Grease”},{“name”:”Includes”,”normalizedValue”:”TG-30 Thermal Compound, Scraper, (2) Pack of Alcohol Pads, Honeycomb Stencil”,”value”:”TG-30 Thermal Compound, Scraper, (2) Pack of Alcohol Pads, Honeycomb Stencil”},{“name”:”Color”,”normalizedValue”:”Gray”,”value”:”Gray”},{“name”:”Country of Origin (subject to change)”,”normalizedValue”:”China”,”value”:”China”},{“name”:”Package Quantity”,”normalizedValue”:”1″,”value”:”1″}]

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